What are the difficulties in processing Tantalum Plate?
Publish Time: 2024-09-25
Tantalum Plate has important applications in many fields due to its unique properties, but it also brings many difficulties to processing due to its characteristics.
First, the hardness of tantalum is high, which makes cutting difficult. During the machining process, the tool needs to have high hardness and wear resistance to effectively cut Tantalum Plate. Moreover, high hardness also leads to faster wear of the tool during the machining process, increasing the machining cost and time. At the same time, the cutting force is large, which is easy to cause deformation of the workpiece and have an adverse effect on the machining accuracy.
Secondly, tantalum has strong chemical activity. During the machining process, tantalum easily reacts with oxygen, nitrogen, etc. in the air to form a hard oxide film or nitride, which further increases the difficulty of machining. In order to avoid this situation, the machining usually needs to be carried out under the protection of inert gas, which undoubtedly increases the complexity and cost of the machining.
Furthermore, the thermal conductivity of Tantalum Plate is low. During the machining process, the heat is difficult to dissipate quickly, which easily leads to local temperature increase, causing thermal deformation and thermal stress. This requires controlling parameters such as cutting speed and feed rate during the machining process to reduce heat generation. At the same time, effective cooling measures are also needed to ensure temperature stability during processing.
In addition, the precision processing of Tantalum Plate requires a high level of technology and equipment precision. For example, in the electronics industry and other fields with extremely high requirements for dimensional accuracy and surface quality, high-precision processing equipment and advanced processing technology are required to ensure the processing accuracy and surface finish of Tantalum Plate.
In short, the processing difficulty of Tantalum Plate is mainly reflected in high hardness, strong chemical activity, low thermal conductivity and high requirements for precision processing. These difficulties need to be overcome by selecting suitable tools, controlling the processing environment, optimizing processing parameters and using advanced processing equipment and technology to meet the processing needs of Tantalum Plate in different fields.
